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E2A0013-16-X1
Semiconductor MSM7510
Semiconductor 300 bps Full Duplex FSK Modem - ITU-T V.21
This version: Jan. 1998 MSM7510 Previous version: Nov. 1996
GENERAL DESCRIPTION
The MSM7510 is useful for the ITU-T V.21 modem, for examples, low cost built-in modems, telecontrol systems, home security systems, etc. The family version, MSM7512B for ITU-T V.23, will be available following this device. Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these devices need two power supplies, +5 V for digital and +12 V for analog. New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power consumption.
FEATURES
* Conforms to ITU-T V.21, 300 bps Full Duplex * ITU-T V.25 Answer Tone (2100 Hz) with Generator/Detector * Single Power Supply : +3 V to +5 V * Low Power Consumption Operating Mode: 25 mW Typ. Power Down Mode : 0.1 mW Max. * Line Hybrid Circuit on Chip (direct drive capability of 600W) * ALB (Analog-Loop back) with test mode. * 3.579545 MHz Crystal Oscillator * Digital Interface: TTL * Package options: 16-pin plastic DIP (DIP16-P-300-2.45) (Product name: MSM7510RS) 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM7510GS-K)
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Semiconductor
MSM7510
BLOCK DIAGRAM
AI (2)
+ -
Demodulator FSK & ANS Bandpass Filter Modulator *R3 *R2
-
*R1
*R1 *R2 *R2
+
AOG
RD (9) CD (10) XD (11) RS (12)
AO (3) EAI (4) X1 (6) X2 (7) CLK (8) VDD (1) GND (5)
O/A (13) OSC CLK GEN. CONT. MOD2 (15) SG GEN. AOG (16) MOD1 (14)
* R1 to R3 50 kW ( ) : for MSM7510RS
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Semiconductor
MSM7510
PIN CONFIGURATION (TOP VIEW)
VDD 1 AI 2 AO 3 EAI 4 GND 5 X1 6 X2 7 CLK 8 16-Pin Plastic DIP
16 AOG 15 MOD2 14 MOD1 13 O/A 12 RS 11 XD 10 CD 9 RD
VDD 1 NC 2 AI 3 NC 4 AO 5 EAI 6 GND 7 X1 8 NC 9 X2 10 NC 11 CLK 12 24-Pin Plastic SOP NC: No connect pin
24 AOG 23 NC 22 MOD2 21 NC 20 MOD1 19 O/A 18 RS 17 XD 16 NC 15 CD 14 NC 13 RD
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Semiconductor
MSM7510
PIN DESCRIPTION
No. RS GS-VK 1 2 3 4 5 6 7 8 9 1 3 5 6 7 8 10 12 13 Name VDD AI AO EAI GND X1 X2 CLK RD I/O -- I O I -- I O O O +3 V to +5 V Power Supply Analog receive signal input. Analog transmit signal output. External analog signal input. The signal applied to this pin is transmitted from AO via transmit output amplifier. When not using this pin, it should be left opened. Ground, 0 V. 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock 3.579545 MHz to the device, it should be applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1 has to be opened. 3.579545 MHz clock signal output. Modem receive serial data output. Digital "1" and "0" correspond to "Mark" and "Space", respectively. When CD (Carrier Detect) is off, RD is held at "Mark" state. 10 11 12 15 17 18 CD XD RS O I* I* FSK receive signal and answer tone detect. Digital "0" and "1" represent "Detect" and "Non-detect", respectively. Modem transmit serial data input. Digital "1" and "0" correspond to "Mark" and "Space", respectively. FSK signal and answer tone transmit enable. When digital "0" is applied to RS, transmitting becomes enable. Originate/Answer mode select. 13 14 15 16 19 20 22 24 O/A MOD1 MOD2 AOG I* I* I* I* Digital "1" AE Originate mode Digital "0" AE Answer mode Operation mode select. Refer to Table 1. Analog transmit signal amplitude select. Digital "1" AE -10 dBm Typ. at AO Digital "0" AE -4 dBm Typ. at AO Description
Note :
I* : Internally pulled-up input pin.
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Semiconductor
MSM7510
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25C, With respect to GND -- Rating -0.3 to +7 -0.3 to VDD + 0.3 -55 to +150 Unit V V C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Input Clock Frequency VDD Bypass Capacitor Oscillation Frequency Frequency Deviation Temperature Characteristics Equivalent Series Resistance Load Capacitance Symbol VDD Top fCLK CVDD -- -- -- -- -- Condition -- -- To 3.579545 MHz VDD - GND -- +25C 5C -40C to +85C -- -- Min. +2.7 -40 -0.1 10 -- -100 -50 -- -- Typ. -- -- -- -- 3.579545 -- -- -- 16 Max. +5.5 +85 +0.1 -- -- +100 +50 50 -- Unit V C % mF MHz ppm ppm W pF
ELECTRICAL CHARACTERISTICS
DC Characteristics
( VDD = +2.7 V to +5.5 V, Top = -40C to +85C) Parameter Power Supply Current Digital Input Voltage Digital Input Leakage Current Digital Output Voltage Symbol IDD ISS VIL VIH IIL IIH VOL VOH Condition Operating Mode Power Down Mode -- -- VI = 0 V * VI = 5 V IOL = 1.6 mA IOH = -0.4 mA Min. -- -- 0 2.2 -80 -10 0 2.4 Typ. 5.0 5.0 -- -- -- -- 0.2 -- Max. 10.0 20.0 0.8 VDD 10 10 0.4 VDD Unit mA mA V V mA mA V V
Crystal
*
Internally pulled-up pins
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Semiconductor AC Characteristics Modulator/analog output (AO) characteristics
MSM7510
(VDD = +2.7 V to +5.5 V, Top = -40C to +85C) Parameter FSK Transmit Signal Frequency V. 25 Answer Tone Frequency FSK Transmit Signal, Answer Tone Amplitude Analog External Input Signal Gain FSK Transmit Signal Amplitude Ratio Out-of-band Energy Output Offset Voltage Output Load Resistance VSPS VOFF RAO 4 kHz to 8 kHz P : In-band Signal Energy 8 kHz to 12 kHz (0.3 kHz to 3.4 kHz) More than12 kHz To VDD/2 -- -- -- -- -150 600 -- -- -- -- -- P-20 P-20 P-60 +150 -- dB dB dB mV W VAOD VAO(MARK) - VAO(SPACE) -2 0 2 dB VAO2 VEA1 VEA2 VAO - VEAI Symbol fOM fOS fAM fAS fAST VAO1 AO AOG = "1" AOG = "0" AOG = "1" -12 -2 -8 -10 0 -6 -8 2 -4 dBm dB dB Condition Originate Mode Answer Mode XD = "1" XD = "0" XD = "1" XD = "0" Min. 976 1176 1646 1846 2096 -6 Typ. 980 1180 1650 1850 2100 -4 Max. 984 1184 1654 1854 2104 -2 Unit Hz Hz Hz Hz Hz dBm
Answer Tone Mode RS = "0" AOG = "0"
*
0 dBm = 0.775 Vrms
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Semiconductor Demodulator/analog input (Al, EAI) characteristics
MSM7510
( VDD = +2.7 V to +5.5 V, Top = -40C to +85C) Parameter Receive Signal Amplitude Receive Signal Detect Amplitude (CD) Hysteresis (CD) CD Delay Time CD Hold Time Receive Data (RD) Bias Distortion Answer Tone Detect (CD) Freq. Answer Tone Detect, Non-Detect Amplitude (CD) Input Resistance FAOF RAI REAI Non-Detect, at AI AI EAI -- -- 20 -- 10 -- -60 -- -- MW kW Symbol VAI VON VOFF VHYS tCDD tCDH DBS fASR VAON Condition FSK Signal, at AI FSK Signal, at AI I/O Alternative Pattern VON AE VOFF See Fig. 1 FSK Signal, Answer Tone 300 bps, I/O Alternative Pattern 2100 Hz Detect, at AI OFF AE ON OFF AE OFF Min. -- -- -48 -- 5 20 -10 -20 -46 Typ. -- -- -- 2 15 40 -- -- -- Max. -6 -42 -- -- 20 60 10 20 -6 dB Unit dBm dBm dBm dB ms ms % Hz
*
0 dBm = 0.775 Vrms
AI
CD
tCDD
tCDH
Figure 1 Carrier Detect (CD) Timing
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Semiconductor
MSM7510
OPERATION MODE
Table 1 Operation Mode
MOD2 0 0 1 1 MOD1 0 1 0 1 Mode FSK Modem Normal Mode (Fig.2) Analog Loop Back Test Mode (Fig.3) Answer Tone Transmit/Detect Mode* Power Down Mode
* Answer Tone Transmit: RS = "0" RS = "1" Answer Tone Detect: Detect Non-detect
AE AE AE AE
Enable Disable CD = "0" CD = "1"
When transmitting the answer tone, CD is held at digital "1".
AI
Phone Line
Receive Filter
Demodulator
RD DTE
AO
Transmit Filter
Modulator
XD
Figure 2 FSK Modem Normal Mode
AI
Phone Line
Receive Filter
Demodulator
RD DTE
AO
Transmit Filter Modulator
XD SG
Figure 3 Analog Loop Back Test Mode
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Semiconductor
MSM7510
APPLICATION CIRCUIT
600 W : 600 W 2.2 mF Lone
- +
MSM7510RS VDD AI AO 600 W EAI GND 10 mF X1 X2 3.58 MHz CLK 8
+ -
1
AOG MOD2 MOD1 O/A RS XD CD RD
16
CONT.
9 To other circuit
MSM7510RS 600 W : 600 W 2.2 mF Line
- +
External Clock
VDD AI AO 600 W EAI GND 10 mF X1 X2 100 pF CLK 8
+ -
1
AOG MOD2 MOD1 O/A RS XD CD RD
16
CONT.
9
3.58 MHz External Analog Transmit Signal
2.2 mF
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Semiconductor
MSM7510
An Example of the External Adjustment for a Transmitting Level and Detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit.
51 kW VAOL Line 600 W VAIL 51 kW
- +
R2
- +
R1
2.2 mF
VAO AO
600 W R3
R4
- +
51 kW 51 kW AI 2.2 mF VAI
Line transmitting level : VAOL = VAO (R2/R1) IC input level : VAI = VAIL (R4/R3)
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Semiconductor
MSM7510
PACKAGE DIMENSIONS
(Unit : mm)
DIP16-P-300-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.99 TYP.
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Semiconductor
MSM7510
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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